Your company is planning to add new line cards to all the core routers in the network to manage
expected growth in network traffic. As part of the upgrade plan, new higher-capacity power
supplies are being deployed prior to adding the new line cards to the routers. These new power
supplies have voltage and temperature monitoring capability that the existing power supplies do
not. You are attending a meeting with the engineering team to discuss the plan and support the
development of the method of procedure to replace the power modules.
Which two areas regarding the plan to roll out the new power modules should be addressed?
(Choose two.)
A.
SNMP MIB update
B.
wiring to the fuse panel
C.
fire resistance
D.
EMI emission
E.
heat dissipation